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A Revolutionary Application Package to Provide First-Principles Thermal Management Guide for Microchip Designs

An application package for thermal environment prediction in existing microchips under operating conditions and also informing future design

Published: 4th July 2022
A Revolutionary Application Package to Provide First-Principles Thermal Management Guide for Microchip Designs
Source: vchalup, https://stock.adobe.com/uk/159301202, stock.adobe.com